Heat conduction analysis software - List of Manufacturers, Suppliers, Companies and Products

Heat conduction analysis software Product List

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Steady-state thermal analysis sets heat capacity to zero!

In the heat conduction module, it is possible to calculate the time variation of temperature! If you only want to know the temperature distribution, set the heat capacity to zero for steady-state thermal analysis!

In the heat conduction module, unsteady thermal analysis is performed. You can track how the temperature changes over time. If you only want to know the final temperature distribution, you can set the heat capacity to zero and perform steady-state thermal analysis. For details, please refer to "NO.009 Steady-State Thermal Analysis with Heat Capacity Set to Zero" on 【Analysis Know-How.com】. Key points are as follows: - The heat conduction module allows for the calculation of time-dependent temperature changes (unsteady). - The material properties provided are thermal conductivity and heat capacity. - Thermal conductivity measures how easily heat is transferred, with units of W/mK. - Heat capacity measures how easily temperature increases, with units of J/m³K. - If you only want to see the final temperature, you can perform steady-state thermal calculations. - This can be done by setting the heat capacity to zero. - The heat transfer handbook is recommended.

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[Analysis Case] Thermal Conductivity Analysis of a Circular Cylinder (Comparison with Theoretical Solutions)

We will conduct thermal conduction analysis under three conditions! Here, we will introduce a case study using a circular pipe model.

We will introduce an analysis case that focuses on the boundary conditions used in thermal conduction analysis, comparing theoretical solutions with simulation results. The thermal conduction analysis software "PHOTO-THERMO" can be used not only for coupled analysis using heat generation density obtained from electromagnetic field analysis but also independently. In this case, we used a circular pipe model as shown in the left figure. We conducted thermal conduction analysis under three conditions: "constant temperature boundary condition," "heat generation density," and "heat transfer boundary condition." Since theoretical solutions can be obtained for all of these, you can evaluate the validity of the program by comparing the analysis results. [Case Overview] ■ Conditions for Thermal Conduction Analysis - Constant temperature boundary condition - Heat generation density - Heat transfer boundary condition *For more details, please refer to the related links or feel free to contact us.

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Non-steady heat calculation for heating and cooling at 【Analysis Know-How.com】!

The flow rate of the cooling water is approximated by the heat transfer coefficient! Evaluated with animations and temperature history at evaluation points!

In the heat conduction version, you can define heating elements and cooling pipes. It is a simple analysis, but it allows for easy unsteady temperature analysis. For more details, please refer to "NO.101 ex Heat Conduction Version Introduction: Seeking Temperature Distribution and Changes" on 【Analysis Know-How.com】. Here are the key points: - Unsteady temperature analysis can be performed. - The flow rate of the cooling water is approximated by the heat transfer coefficient. - You can set the heating and non-heating of the heating elements. - Calculations are performed for time steps. - Evaluation is done through animations and temperature history at evaluation points.

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[Example] Thermal conduction analysis using thermal coupling functionality

We analyzed the temperature distribution of heat conduction due to heat generation from the chip in a structure composed of a chip, substrate, edge guide, and case.

【Case Overview】 ■Product Name: Femap Thermal ■Analysis: Thermal Analysis ■Industry: Mechanical Components Modeling thermal connections between components can be challenging due to thermal resistance from contact and heat conduction at adhesive joints. By using the thermal coupling feature, it is possible to define conductive conductance, thermal conductivity, or thermal resistance values between distant meshes that do not share nodes, allowing for thermal coupling in calculations between these distant meshes. This is an excellent feature that automatically considers the positional relationships of elements and allocates the degree of thermal coupling for each element. In this analysis case, we will analyze the temperature distribution due to heat generation from a chip within a structure consisting of four types of components: chip, substrate, edge guide, and case. The adhesive between the chip and substrate, as well as the edge guide that connects the substrate and case, were modeled using thermal coupling. □ For other functions and details, please refer to the catalog.

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Thermal conduction analysis software THERMO

Finite Element Method Thermal Conduction Analysis Software (Simulator)

2D axisymmetric and 3D heat conduction analysis simulator using the finite element method ■□■Features■□■ ■ Since it is integrated with the PHOTO series dedicated pre- and post-processing, data creation, analysis, and result processing can be performed as a single operation. ■ It is integrated with other PHOTO series modules, allowing for easy coupled analysis, such as determining temperature distribution from heat generation obtained through electromagnetic field analysis. ■ It uses the ICCG method, enabling fast calculations and analysis on a personal computer. ■ Since it employs the finite element method, the solutions are stable, making it safe for beginners to use. ■ Coupled calculations with stress analysis and fluid analysis are easy to perform.

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熱伝導解析ソフト 【μ-TM 誘導加熱の磁場・温度解析ソフト】

3次元誘導加熱解析ソフト、コイルの移動なども簡単に設定できます

解析に不慣れな設計・研究の方にも、手軽に操作できるソフトに仕上げています。簡単なコイル設定で、加熱コイルの移動もインターフェースで簡単に設定できます 詳細は【解析ノウハウ.com】の「063 μ-TMの紹介」をご覧ください ポイントはこちら ・誘導加熱・温度解析の専用ソフト ・加熱コイルの有限要素分割は不要 ・複雑なコイル形状やコイルの移動が簡単 ・ウィザード形式で解り易い条件設定 ・3次元誘導加熱解析をもっと身近に さらに ・お客様の問題に踏み込んだ、プロのコンサルティングをご提供 ・受託解析や、カスタム開発も、安価にご提供いたします

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Heat conduction analysis software 【μ-EXCEL Mold Cooling Version】

You can see the design of the mold cooling circuit, the cooling process of pressed products, and the temperature rise process during the insertion and ejection cycle!

μ-Excel is analysis software that uses a two-dimensional (or axisymmetric) finite element method. It consists of individual packages for each analysis theme, allowing for smooth analysis through customized input and output screens for each theme. Additionally, it utilizes Excel macros in its GUI, enabling users to operate it seamlessly in the familiar Excel environment. Furthermore, it can be introduced at a lower cost compared to other analysis software. The academic version is even more economical! It is evolving into a wide range of themes, not only for electromagnetic field analysis but also for heat, structure, fluid, and electromagnetic waves. Please look for the series that matches your theme (currently, there are a total of 11 series). 【Features】 - Designed for cooling circuit design of press parts using molds - Settings for initial temperature of press parts, position, number, and heat absorption amount of cooling pipes on the mold side - Calculation of unsteady temperature during the cooling process after pressing and repeated insertion of new press parts - Ability to set heat transfer coefficients based on pressing pressure - Display of temperature changes *For more details, please contact us or download the PDF.

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熱伝導解析ソフト 【μ-EXCEL 誘導加熱版】

材料特性は磁場解析と温度解析用が必要!高周波コイルは加熱ON/余熱OFFが設定できます!

IHクッキングは誘導加熱原理を使っています。高周波コイルで発生した磁場をお鍋の底に当てると渦電流が発生します、ここまでが磁場解析。渦電流は発熱を起こしお鍋の底からお水へ熱が伝わり温度が上昇します、ここは熱解析。誘導加熱は狙った場所を短時間で加熱できるので、様々なところに利用されています 詳細は【解析ノウハウ.com】の「NO.019 ex誘導加熱版の紹介 」をご覧ください ポイントはこちら ・誘導加熱によりワークの温度変化を見ます ・渦電流は磁場解析で求めるのでモデルに空間が必要 ・渦電流はワーク表面を薄く流れるので、メッシュを細かく ・材料特性は磁場解析と温度解析用が必要 ・高周波コイルは加熱ON/余熱OFFが設定できる

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Heat conduction analysis software 【μ-COOL thermal insulation coating temperature analysis software】

With just simple information input, the temperature effects before and after painting can be measured on the spot!

μ-COOL is a temperature simulation software that calculates temperature on Excel. By simply entering painting conditions and room sizes, it can calculate the temperature effects before and after painting on the spot. It serves as a powerful persuasive tool during discussions with clients. ■Features - Uses Excel macros - Utilizes NEDO's solar radiation database - Allows setting the size of facilities (factories), etc. - Calculates indoor temperature changes over 10 days - Computes the temperature reduction effects with and without heat-reflective paint - Customizable *For more details* If you have any questions, please feel free to contact us!

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Heat conduction analysis software 【μ-EXCEL Heat Conduction Edition】

The flow rate of the cooling water is approximated by the heat transfer coefficient! Evaluated using animations and temperature history at evaluation points!

In the heat conduction version, you can define heating elements and cooling pipes. It is a simple analysis, but it allows for easy transient temperature analysis. For details, please refer to "NO.101 Introduction to the Heat Conduction Version: Seeking Temperature Distribution and Changes" on 【Analysis Know-How.com】. Here are the key points: - Transient temperature analysis is possible. - The flow rate of the cooling water is approximated by the heat transfer coefficient. - You can set the heating and non-heating of the heating elements. - Calculations are performed for time steps. - Evaluation is done through animations and temperature history at evaluation points.

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